Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Modern CPUs and GPUs push well past 700 W, and air cooling no longer moves that heat. Learn how cold-plate liquid cooling, any-layer HDI Shenzhen factory
DO-254 governs design assurance for airborne electronic hardware, from an IPC Class 3 factory
Designing a board for 112G or 224G SerDes is a channel problem: not a routing problem. Learn the insertion-loss budget, low-loss laminate selection
A PCB purchase order is the bridge between a quote and a build, and the 6 mistakes that cause re-quotes and delays
An ECO to a PCB has ripple effects far beyond the board: re-quotes, stale parts
A BOM for PCB assembly is not a parts list: it is a manufacturing contract. Learn the required fields
Wide-bandgap SiC and GaN switch faster than silicon, high dV/dt EMI, creepage for 800V, thermal via strategy and the board material that holds it together
Conductive anodic filament (CAF) is a hidden PCB reliability killer that only shows up months into field use. Learn the failure mechanism
Designing a 77-81 GHz automotive radar PCB is a high-frequency discipline: low-loss RF laminate, tightly toleranced etching
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