Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
How to calculate SMT line capacity correctly: boards per hour, placement-rate derating, changeover impact, OEE and bottleneck identification. A planning framewo
When stencil-free SMT beats stencils for NPI and prototype builds: tooling cost, changeover time, break-even volume, paste jetting and dispense options, and how
How to evaluate a solder paste jetting machine: deposit volume accuracy in nL, jetting frequency, nozzle selection, and a break-even cost model against stencil
PCB fiducial mark design rules: fiducial size and shape, solder mask clearance, global vs local fiducials, minimum placement from board edge, and how pick-and-p
PCB depanelization methods compared: V-score vs tab routing vs laser cutting. Depth rules, edge quality, flexible board handling, cost and yield, and how to cho
PCB silkscreen legend design rules: minimum line width and character height per IPC-2221, reference designator placement, polarity and pin-1 marks, and the DFM
Choose the right thermal interface material (TIM) for a power PCB: gap pad vs thermal paste vs phase-change vs liquid metal, thermal conductivity, thickness, pr
Combine a low-loss RF laminate (Rogers) with economical FR-4 in a single stackup: Dk and Df fields, CTE matching, prepreg selection, layer ordering, impedance p
Design the LAN magnetics module right: isolation transformer turns ratio, common-mode choke, 1500V isolation, creepage, Bob Smith termination, and PoE-class mag
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