Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
How to calculate solder paste grams per board, where 35 to 60 percent of paste is lost, which losses are legitimate, and how to audit a supplier paste consumption claim.
How stencil foil thickness sets paste volume per joint, area ratio limits by thickness, transfer efficiency by aperture size, and how to specify thickness in a PO.
What to decide when an SMT line stops mid-batch: paste working life, stencil dwell, paste abandon rules, reflow requalification and the quarantine gate after restart.
Attribute solder paste printing defects across six inputs with numeric gates: area ratio 0.66, SPI Cpk 1.33, volume bands. Includes a 90-minute supplier audit.
How to qualify alternate components properly: five validity conditions, four risk tiers, six silent-change traps and the certification rules for automotive, medical and UL.
What a compliant moisture-barrier pack contains, desiccant quantity by bag area, how to read a humidity indicator card at receiving, and how to prove a transit claim.
A passed 1,000-cycle thermal cycling test means little without profile
How to turn a defect report into evidence, and the cheapest experiments that eliminate candidates before you section a board
Why 100-piece orders cost 26% setup and 3,000-piece orders cost 1.6%: the setup amortisation curve, and five questions to ask an assembly house
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