Industries / Telecom & 5G

Signal Integrity at
GHz Speeds.

5G AAU beamforming with 64T64R antenna arrays. 800G optical line cards with 32-layer backplanes. Data center switches routing terabits. Rogers, Megtron 6, and Isola high-speed laminates with insertion loss below 0.5dB/in at 28GHz.

32LMax Layer Count

±5%Impedance Control

<0.5dB/inInsertion Loss @28GHz

0.4mmBGA Pitch Routing

Start Telecom RFQ

Manufacturing Excellence

The Backbone of Global Communications.

Up to 32L

High-Layer Backplanes

Up to 32 layers with blind/buried via architecture. Via aspect ratio 10:1 minimum. Registration ±75µm across full panel. For 5G BBU, optical transport, and data center switch backplanes.

<0.5 dB/in

Low-Loss RF Laminates

Rogers 4350B, 4003C, Megtron 6, Isola Astra MT77. Dk 3.0-3.66 ±0.05 tolerance. Insertion loss <0.5dB/in at 28GHz. Hybrid construction with FR-4 for cost optimization on non-RF layers.

±5%

Impedance Control

50Ω single-ended, 100Ω differential for SerDes pairs. Up to 112Gbps PAM4 per lane. TDR-verified on every production lot with ±5% tolerance. Back-drilling for stub removal on high-speed via transitions.

0.4mm

Fine-Pitch BGA Routing

0.4mm pitch BGA escape routing for switch ASICs and FPGAs. Via-in-pad with copper-filled and capped laser microvias. 3/3mil trace/space for high-density escape routing.

10:1

Controlled-Depth Drilling

Back-drilling to remove via stubs on high-speed signal vias (stubs create λ/4 resonance that degrades insertion loss above 10Gbps). Laser depth control ±50µm. For 25-112Gbps SerDes channels.

100%

Electrical Test

4-wire Kelvin on 100% of nets. Impedance coupon TDR on every panel. Flying probe for prototypes, bed-of-nails for production. HiPot to 1500V for telecom power supply isolation.

High-Speed Design

When Every Picosecond
of Skew Matters.

At 112Gbps PAM4, a single bit period is 8.9 picoseconds. Intra-pair skew of 2ps causes a 22% eye closure. For a 32-layer backplane with 14,000+ differential pairs, every pair must be length-matched, every via stub back-drilled, and every impedance transition optimized — or the link budget collapses.

Intra-pair skew <1ps — differential pair length matching to <0.15mm. Verified by TDR on every pair, not sampled. For 56-112Gbps SerDes channels
Back-drilling with ±50µm depth control — removes via stubs that create λ/4 resonant nulls. For any via on a ≥10Gbps net where the signal transitions from top to an inner layer
Dk uniformity ±0.05 across panel — laminate Dk variation causes impedance variation. Low-loss RF laminates (Rogers, Megtron) hold tighter Dk tolerance than standard FR-4
Copper surface roughness <2µm RMS — at GHz frequencies, skin depth is ~0.8µm. Rough copper increases effective path length and insertion loss. Smooth copper foil for RF layers

High-speed digital and RF PCB for telecom infrastructure

Thermal & Power

Dissipating 500W in a
1RU Chassis.

A 5G AAU (Active Antenna Unit) mounts on a tower with no fan, ambient to 55°C, solar loading to 85°C surface, and 64 transmit channels collectively dissipating 500-800W. The PCB is the heat sink. Thermal design is inseparable from electrical design.

Heavy copper power planes — 4-6oz inner layer copper for power distribution. Reduces I²R loss and provides lateral heat spreading. For 48V distribution at 50A+
Thermal via arrays under GaN PA modules — 0.25mm hole, 0.8mm pitch, copper-filled and planarized. <1°C/W junction-to-PCB for 5×5mm GaN die
Metal-core construction for power amplifier PCBs — Aluminum base 1.5-3.0mm, thermal conductivity 1-3 W/m·K. Direct die-attach or solder-mounted PA modules
Embedded copper coin — 2-5mm solid copper insert under extreme heat-flux devices. <0.3°C/W thermal resistance. For 100W+ GaN power amplifiers

Telecom PCB thermal management and power distribution

Telecom Applications & Requirements

Application	Key PCB Demands	Huaxing Solution	Quality
5G AAU / RRU	RF laminate, thermal, 64ch beamforming, outdoor rated	Rogers+FR-4 hybrid, embedded coin, 32L backplane	IPC Class 3
Baseband Units (BBU)	32L backplanes, 112G SerDes, 0.4mm BGA	Megtron 6, back-drilling, ±5% impedance	IPC Class 2+
Optical Transport	Mixed-signal, 800G line cards, ultra-low skew	High-Tg FR-4+Megtron hybrid, <1ps intra-pair skew	IPC Class 2+
Data Center Switches	32-36L, 0.4mm BGA, 112G PAM4, back-drill	Megtron 6, via-in-pad, back-drill ±50µm	IPC Class 2+
Small Cells / DAS	Compact, RF+digital mixed, outdoor, cost-sensitive	6-10L Rogers hybrid, cavity PCB, conformal coating	IPC Class 2+/3
Satellite Ground Terminals	RF to Ku/Ka band, phased array, harsh environment	Rogers 4350B, metal-core, thermal via grids, polyimide	IPC Class 3

Telecom PCB Production Flow

Stackup Design

Impedance modeling. Laminate selection for Dk/Df targets. Hybrid construction plan.

Controlled Fab

Registration ±75µm. Back-drilling ±50µm. Smooth copper on RF layers. Tight Dk laminate.

SMT & Inspection

0.4mm BGA placement. SPI → AOI → X-Ray 100%. Nitrogen reflow. HiPot verification.

Signal Integrity

TDR on every panel. Insertion loss measurement. VNA to 40GHz for RF coupons.

Reliability & Ship

Thermal cycling -40/+125°C. IST coupon testing. 100% 4-wire Kelvin. Full traceability.

Inside the Factory

Telecom-Grade Manufacturing

RF and high-speed digital PCB manufacturing

RF Laminate Processing

Impedance-controlled PCB stackup for telecom

Impedance Stackup Control

5G Infrastructure Production

32-Layer Backplane

Telecom PCB Buyer's Checklist

"Show me impedance TDR data from your last three 28GHz+ production orders."

At 28GHz, even 2Ω impedance variation causes 5% reflection. Generic "±10% impedance" from a capability sheet is meaningless. Ask for production TDR data at the actual operating frequency.

"What's your back-drilling depth control accuracy on production panels?"

Via stubs over 50µm create visible insertion loss degradation above 28GHz. Target: ±50µm depth control across full panel with AOI verification of every back-drilled hole.

"How do you verify laminate Dk consistency lot-to-lot?"

Laminate Dk variation of ±0.05 (Rogers spec) changes 50Ω impedance by ~2.5Ω. Ask for incoming laminate Dk verification data — not the supplier's certificate, your fabricator's own measurement.

"What's your thermal cycling qualification for mixed-material (Rogers+FR-4) hybrid boards?"

Different CTE between Rogers and FR-4 creates shear stress at the bond line. 500 cycles -40/+125°C with cross-section at 0, 250, 500 cycles. No delamination, no barrel cracking.

Certifications & Compliance

ISO 9001 →:2015

ISO 14001:2015

UL E354321

IPC-A-610 Class 2/3

IPC-6012 Class 3

ANSI/ESD S20.20

FCC/CE Pre-Compliance

RoHS 3.0 / REACH

Build the Infrastructure That Connects the World

Send us your stackup, impedance requirements, and board outline. We'll respond within 24 hours with a DFM analysis covering laminate selection, impedance modeling, back-drilling requirements, and thermal management strategy — from a manufacturer that has built telecom PCBs since 2016.

Signal Integrity atGHz Speeds.