Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Complete procurement guide for aerospace and defense PCBs: AS9100/ITAR compliance, MIL-PRF-31032 materials, Class 3/A workmanship, outgassing (ASTM E595)
Corner bond: edge bond or full underfill for BGA and CSP — mechanical performance, application time
No-flow underfill process control for high-volume SMT: flux compatibility testing, reflow profile interaction and yield economics
How to select and qualify a CSP underfill process: capillary vs no-flow vs molded, dispense patterns, void limits, cure schedules
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