Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Solder pallets and process carriers for wave and selective soldering: when tooling is mandatory, material choices, cost drivers
IPC-7351B footprint density levels A, B and C explained for buyers and designers and how footprint choice drives solder defect rates
Gauge R&R and measurement system analysis for PCB and PCBA buyers: %GRR acceptance limits, how to request an MSA study on CMM and AOI data
Press-fit connector assembly guide covering finished hole tolerance windows, barrel plating, press-force curve interpretation
Castellated hole design guide covering half-hole diameter tolerances, barrel plating through the cut, stencil and paste rules, and edge plating
Conformal coating thickness guide covering IPC-CC-830 requirements, wet-film vs cured-film vs microsection measurement
How to manage SMT stencil life by tension measurement, with replacement thresholds and a tool register format
A structured 12-point checklist for visiting a Shenzhen PCB factory: what to inspect, which records to demand and how to convert findings into PO clauses.
Mixed alloy soldering explained: low-melting phase formation, which SAC305/SnPb combinations are viable, reflow profile rules
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