Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Crimp height, pull force and strand damage limits for IPC/WHMA-A-620 Class 2 and Class 3 plus what Class 3 adds to harness cost.
Decode IP65, IP66, IP67 and IP69K, see what each test involves, and learn the six sealing failure modes plus why IP67 does not stop condensation.
ICT, FCT, burn-in and system test compared by failure mode plus what drives FCT fixture cost and why test time is a hidden per-unit cost.
Why a 0402 beats the same value in 0603 above 200 MHz, where parallel capacitors create an anti-resonance peak, and what a board shop can actually verify.
A stale hex file can scrap a whole lot. How firmware revision lock, verify coverage and panel-level programming are controlled in contract assembly.
DC-bias loss, voltage derating and ageing decide whether an MLCC survives. Plus what a contract manufacturer must measure on every incoming reel.
Selective coating eliminates masking but adds programming and cycle-time cost. Learn the break-even model, valve choices and the failure modes to control.
IPC-CC-830 qualifies a coating material, not your process. Learn the test set, the QC vs QPL distinction and the six documents to demand from a supplier.
ASTM E595 sets TML ≤1.0% and CVCM ≤0.10% for vacuum use. Learn which coating chemistries pass, and the bake-out and cure controls that keep them there.
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