Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
How to build a PCBA control plan and PFMEA: PCBA failure modes, the control-plan columns, a worked SMT-line example, and what buyers should demand at PPAP.
Who owns your Gerbers, stencils, test fixtures and source files — and the contract terms, escrow and exit checklist that keep your PCB manufacturing portable.
How grey-market and counterfeit parts reach production, and the incoming-inspection ladder — XRF, decap, DPA, AS6081 — buyers use to verify authenticity.
X-out panels explained: how to specify x-out rules in your purchase order and what it costs to reject them
Solder voiding in BGA and thermal pads explained: how to measure void percentage and how to write it into your spec
How to build a PCBA test strategy: choosing between AOI, ICT, flying probe and functional test, setting coverage targets
PCB tolerance stack-up analysis explained: a worked connector-alignment example and the limits a fabricator can actually hold
Pad cratering is a resin crack under the copper pad: not a solder defect. Learn the thermal, material and design causes
Black pad syndrome explained: the nickel corrosion mechanism behind brittle ENIG solder joints, how microsection and ball shear detect it
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