
Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
How to specify impedance test coupons and read the TDR report, sampling plans and the corrective loop when a coupon fails
Crimp acceptance specs for cable harnesses: pull-force by wire gauge, micro-ohm and voltage-drop limits, continuity and hi-pot testing
Design rules and real tolerances for countersinks: counterbores, depth routing and PCB cavities. What a Shenzhen fab can actually hold
Solder paste jetting vs stencil printing compared on tooling cost, a BOM-mix checklist and a hybrid-line strategy for prototype through pilot production
First Article Inspection (FAI) for PCBA explained: what the first article must verify, the AS9102 vs industry-standard report formats, the dimensional
How to ruggedise agricultural electronics PCBA for the field: IP sealing, 12/24V load-dump and surge protection, 40 to +85C operation
Conformal coating changes the PPAP evidence required. Thickness: coverage
A PFMEA is the document that decides which PCB assembly risks get controlled and which get ignored. Here is what a credible PFMEA covers
Most 8D reports stop at containment and call it corrective action. Learn how to read the eight disciplines, and what to require when a defect recurs