Blog — PCB Manufacturing Insights

Wave Solder Process Control — Flux, Preheat, Contact | Huaxing PCB

Wave solder defects trace to five parameters, wave height and alloy condition. Learn the control windows and what to specify on a PO

Solder Alloy Verification — OES & XRF for SAC305 | Huaxing PCBA

Wrong or drifted solder alloy causes cold joints, icicles and RoHS failures. Learn how OES and XRF verification work and what to require from a supplier.

Defect Escape Rate & DPMO Targets | Huaxing PCBA

Escaped defects reach your line, not the supplier's scrap bin. Learn how to define escape rate, set DPMO acceptance on a PO, and audit AOI/ICT coverage gaps.

Solder Balling & Beading Defects — Causes, Acceptance Criteria & Process Fixes

Solder balling and beading cause field failures and rework. Learn the root causes: IPC-based acceptance criteria and an ordered fix path for paste

Reflow Oven Profiling — Thermocouple Setup, Soak vs Ramp & Process Windows

A filed reflow profile is not process control. Learn thermocouple setup, process windows and the PWI — and how to verify a supplier's thermal control

Pick-and-Place Machine Capability — Placement Cpk, Feeder Types & Tape-and-Reel Handling

Placement accuracy stats hide the real risk. Learn placement Cpk, and the 7 capability questions to ask an SMT supplier

Rigid-Flex PCB Design & Manufacturing — Stackups | Huaxing PCBA

Rigid-flex construction types: stiffeners and the cost drivers behind a hybrid PCB. What to specify before you commit to a build

Creepage & Clearance for High-Voltage PCB — IEC 60664 & IPC-2221 Rules

Creepage and clearance spacing tables for high-voltage PCB design: pollution degree, altitude derating, IPC-2221 vs IEC 60664 limits, and coating credit.

Annular Ring & Pad-to-Hole Rules — Sizes, Tolerances | Huaxing PCB

Minimum annular ring by IPC class and how IPC-A-600 grades a breakout. The fabrication spec most quotes assume

Insights & Resources