Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Flip-chip PCB substrate requirements: 40μm bump pitch, low-CTE core materials, capillary underfill process windows, and thermal via arrays for 100W+ die. A sour
Complete flex PCB design and manufacturing guide: polyimide vs polyester substrates, IPC-2223 bend radius rules, coverlay vs solder mask, dynamic vs static flex
PCB manufacturing requirements for fire alarm control panels, smoke detectors, and life safety systems. UL 864 compliance, high-temperature reliability, and red
Fine-pitch SMT assembly guide for 01005 and 0201 components — placement accuracy, laser-cut stencil design, Type 4/5 solder paste, reflow profiling, and AOI res
Complete PCB design and manufacturing guide for EV traction inverters. Covers 800V SiC/GaN power stages, heavy copper 4-12oz, high-voltage isolation per IEC 606
Complete PCB design and manufacturing guide for EV on-board chargers (OBC) and DC-DC converters. Covers 800V high-voltage isolation, SiC MOSFET gate drivers, pl
EV BMS PCB manufacturing guide: high-voltage isolation design, cell monitoring accuracy, ISO 26262 functional safety, and thermal management for 400V/800V batte
How to design and manufacture PCBs for EV Battery Management Systems (BMS). Covers high-voltage isolation (800V+), shunt vs Hall-effect current sensing, ISO 262
ENIG, HASL, OSP, Immersion Silver, Immersion Tin, ENEPIG — which surface finish is right for your application? Compare cost, shelf life, solderability, and reli
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