Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Why tombstoning and head-in-pillow defects pass X-ray, what pad geometry and package warpage cause them, and the process controls that prevent both.
The eight solder paste printing defects that survive to reflow, the print parameters behind each, and the corrections that hold on a high-volume SMT line.
Which PCB test coupons to specify for impedance, microsection, solderability and reliability testing, and where they must sit on the panel to be meaningful.
How two-phase immersion fluid affects PCB laminates, cleaning limits and a supplier checklist for immersion boards
Outgassing classes: material selection and IPC Class 3 cleanliness for PVD, CVD and ALD control electronics. Supplier checklist for deposition tool OEMs
How pin count: pitch and impedance budgets drive probe card substrate fabrication, line width, layer count, via-in-pad
Which PCBA parameters need control charts: how to read X-bar and R chart limits, the Cpk 1.33 vs 1.67 threshold
Which ISO 14644 cleanroom class each PCB process needs: where Class 7/6 is oversold, how particles cause field failures
IPC-2221 conductor spacing, with the tolerances a Shenzhen fab actually holds in volume and an RFQ design-rule checklist
Upload your Gerber files and BOM. We'll respond within 24 hours with a detailed quote and free DFM review.