Manufacturing Capabilities
From prototype to production: every process, every material, every standard.
PCB Fabrication
Manufactured to IPC-A-600 Class 2/3. 100% AOI and electrical test on every board.
| Parameter | Standard | Advanced |
|---|---|---|
| Layer Count | 2–16 layers | 17–58 layers |
| Board Thickness | 0.4mm–3.2mm | 0.2mm–6.0mm |
| Min Trace / Space | 5/5mil | 3/3mil |
| Min Mechanical Hole | 0.25mm | 0.15mm |
| Min Laser Via | 0.10mm | 0.075mm |
| Impedance Control | ±10% | ±5% |
| Max Board Size | 500×600mm | 600×800mm |
| Copper Weight | 1oz–3oz | 0.5oz–6oz |
| HDI Type | 1+N+1, 2+N+2 | Any-Layer |
| Solder Mask | Green, Blue, Black, White, Red, Yellow, LPI | |
| Silkscreen | White, Black, Yellow, Legend print | |
| Surface Finish | ENIG, OSP, HASL (Lead-free), Immersion Silver, Immersion Tin, ENEPIG, Hard Gold | |
| Base Materials | FR-4, High-Tg FR-4, Rogers 4350B/4003C, PTFE (Taconic/Arlon), Aluminum, Ceramic (Al₂O₃/AlN), Polyimide | |
| Special Processes | Back-drill, Counterbore, Edge Plating, Carbon Ink, Peelable Mask, Gold Fingers (30μ") | |
PCBA Assembly
| Parameter | Capability |
|---|---|
| SMT Lines | 8 high-speed lines (Yamaha YSM20R / ASM Siplace) |
| Daily Capacity | 8,000,000 placements / day |
| Min Component | 0201 (0.6×0.3mm) |
| Min BGA Pitch | 0.3mm |
| Max PCB Size | 500×600mm |
| Component Types | BGA, QFN, QFP, SOP, SOIC, PLCC, LGA, CSP, PoP, 01005 |
| DIP Lines | 4 wave-soldering lines (Lead-free) |
| Inspection | SPI (Solder Paste), AOI (Pre & Post-Reflow), X-Ray (BGA/QFN), ICT, FCT |
| Conformal Coating | Acrylic, Silicone, Urethane, Selective spray / Manual brush |
| Acceptance Standard | IPC-A-610 Class 2 & Class 3 |
Components Sourcing
500K+ SKU access through 200+ authorized distributors. Turn-Key, Consigned, or Partial. BOM cost optimization, counterfeit prevention, 100% incoming inspection.
We source everything. You receive assembled, tested PCBs, one invoice, one supplier, one point of accountability.
You supply the components. We manage incoming inspection, MSL handling, and kitting with full traceability.
You consign critical/specialty ICs. We procure passives, connectors, and standard parts. Best of both worlds.
Materials
Every application demands a different material. We stock 20+ laminate types.
Standard Tg 130–140°C. Cost-effective for consumer electronics and general-purpose applications.
Tg 170–180°C. Superior thermal stability. Automotive, industrial, and lead-free assembly compatible.
Low Dk/Df. High-frequency RF/microwave. 5G, radar, satellite communication.
Thermal conductivity 1.0–3.0 W/m·K. LED lighting, power supplies, motor drives.
Al₂O₃ / AlN. Thermal cond. 20–170 W/m·K. High-power RF, aerospace, extreme environments.
Ultra-low Dk (2.1–2.9). Microwave, millimeter-wave. Taconic / Arlon equivalents.
Flex and rigid-flex. High temp resistance. Aerospace, medical, wearable devices.
Hybrid stack-ups for cost-performance optimization. FR-4 + Rogers, FR-4 + PTFE.
Application Showcase
IATF 16949 certified manufacturing for ADAS control units, battery management systems, engine ECUs, and infotainment platforms. AEC-Q100 qualified component sourcing.
IPC Class 3 assembly for diagnostic imaging, patient monitoring, and therapeutic devices. Full traceability with lot-level records maintained for 10 years.
Heavy copper (up to 6oz) for high-current motor drives, PLCs, and power supplies. Conformal coating for harsh environments. -40°C to +125°C operating range.
High-frequency Rogers and PTFE laminates for base stations, antenna arrays, and optical transceivers. Controlled impedance ±5% for signal integrity at GHz frequencies.
Send us your specs. Our engineering team reviews every inquiry and responds with DFM feedback within 24 hours.
Upload Gerber + BOM, 24h quote with free DFM review.