Industries / Industrial Control
PLCs running 24/7 for a decade on factory floors. Servo drives switching kilowatts at 16kHz. VFDs dissipating 200W in a sealed enclosure. Heavy copper to 12oz, -40°C to +125°C, 10+ year lifecycle component management.
Manufacturing Excellence
From 1oz standard to 12oz busbar-replacement copper. Etching process optimized per copper weight. Minimum trace/space at 10oz: 12/15mil. Selective heavy copper reduces cost vs. all-layer heavy copper by ~40%.
Single-sided to 32-layer backplanes. 6-layer heavy-copper hybrid stackup: L1/L6 at 10oz for power, L2-L5 at 1oz for signal. Single lamination cycle.
High-Tg FR-4 standard for all industrial builds. Polyimide for extreme environments (250°C+). Metal-core for LED drivers and motor controller power stages. CTI ≥600V laminates for 400V+ designs.
For compact DIN-rail modules, HMIs, and IIoT gateways. Any-layer HDI with 75µm laser microvias. 0.3mm minimum board thickness.
400V to 1500V working voltage designs. Creepage/clearance per IEC 60664. Isolation slots with post-routing debris wash and HiPot verification. Conformal coating for outdoor enclosures.
SPI on 100% of pads. AOI on 100% of boards. X-Ray on 100% of BGAs. SPC on 14 critical dimensions with CpK ≥1.67. Thermal cycling qualification on every new heavy-copper design.
Heavy Copper Engineering
At 200A continuous, a PCB trace needs cross-sectional area equivalent to a 4 AWG (~25mm²) copper cable. Heavy copper isn't simply "use thicker foil." The etching process changes fundamentally — lateral undercut becomes more pronounced, requiring wider minimum trace/space. Our process engineers optimize etching parameters per copper weight to maintain trace width control.
Materials & Environment
Consumer FR-4 with Tg 130°C delaminates within months on a factory floor at 85°C ambient with thermal cycling every shift change. Industrial PCBs need materials selected for the application environment — not the cheapest option that passes at room temperature.
| Application | Key PCB Demands | Huaxing Solution | Quality |
|---|---|---|---|
| PLC / PAC Controllers | High-layer backplanes, mixed-signal isolation, 10+ year lifecycle | Up to 32L, ±5% impedance, lifecycle component mgmt | IPC Class 2+ |
| Servo & VFD Drives | Heavy copper 6-12oz, 400V+ isolation, IGBT power stages | 12oz copper, 4kV HiPot, metal-core, thermal via grids | IPC Class 2 min |
| HMI & Industrial Display | Fine-pitch connectors, EMI shielding, flex/rigid-flex | 3/3mil, ENIG, selective EMI shielding, rigid-flex 8L | IPC Class 2+ |
| DIN-Rail Modules | Compact, high-density, sealed enclosure, vibration resistant | Any-layer HDI, 0.3mm min, high-Tg, conformal coating | IPC Class 2+ |
| Industrial IoT Gateways | RF+digital mixed, 4G/5G/LoRa, -40°C to +85°C | Rogers+FR-4 hybrid, ±5% impedance, extended-temp | IPC Class 2+ |
| Power Supplies | Heavy copper, HV clearance, UL certified | 6-12oz copper, 4kV HiPot, metal-core, UL E354321 | IPC Class 2/3 |
Heavy copper DFM. Material selection for temp range. Lifecycle component strategy.
Copper-weight-optimized etching. High-Tg lamination. CAF-resistant processing.
SPI → AOI → X-Ray on 100%. Thermal profile per copper weight. HiPot on every board.
Thermal cycling -40/+125°C, 500 cycles. Cross-section analysis. CAF resistance verification.
Full test data, CoC, SPC reports. Component EOL monitoring active. 99.2% OTD.
Supplier Qualification
Every PCB shop lists "heavy copper" in their capability sheet. Few process it weekly. Ask for evidence — not capability claims.
Inside the Factory
Ask for monthly heavy-copper order count and customer references. A shop doing one 10oz order per quarter hasn't mastered the process.
CAF-resistant laminates and properly cured prepreg are the prevention. Ask for 1000-hour CAF test data (85°C/85%RH, DC bias) on the specific laminate for your boards.
Post-routing: AOI of slot edges for burrs, high-pressure DI water wash to remove debris, HiPot across the slot after wash. All three — not "visual inspection."
Local coating removal (micro-abrasion or laser), component replacement, re-coating per documented procedure, then re-HiPot before shipment. Not "scrape and spray."
Send us your design files and operating environment specs. We'll respond within 24 hours with a DFM analysis covering heavy copper feasibility, material selection for your temperature range, and lifecycle component strategy — from a manufacturer that has built industrial control PCBs since 2016.
Upload your Gerber files and operating specs. We'll respond within 24h with DFM review, heavy copper analysis, and lifecycle component strategy.