Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
NRE and tooling charges on a PCB assembly order broken into the four cost buckets behind the line item, amortisation math, and when waiving NRE is legitimate.
How to interpret SMT first pass yield correctly: yield definitions that differ between suppliers, benchmark ranges by product class, and a step-by-step method t
When nitrogen reflow is worth the cost: O2 ppm targets by component type, the solderability and wetting physics behind it, and how to audit whether your supplie
How to use SPI data to control solder paste volume: transfer efficiency targets, Cpk acceptance limits, paste height specs and the process window that keeps a l
How to calculate SMT line capacity correctly: boards per hour, placement-rate derating, changeover impact, OEE and bottleneck identification. A planning framewo
When stencil-free SMT beats stencils for NPI and prototype builds: tooling cost, changeover time, break-even volume, paste jetting and dispense options, and how
How to evaluate a solder paste jetting machine: deposit volume accuracy in nL, jetting frequency, nozzle selection, and a break-even cost model against stencil
PCB fiducial mark design rules: fiducial size and shape, solder mask clearance, global vs local fiducials, minimum placement from board edge, and how pick-and-p
PCB depanelization methods compared: V-score vs tab routing vs laser cutting. Depth rules, edge quality, flexible board handling, cost and yield, and how to cho
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