Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
OEE is easy to quote and easy to dress up. Learn which components of SMT line utilisation are auditable: which numbers inflate the figure
Electrochemical migration is the dendritic growth that shorts fine-pitch assemblies in humidity. Learn the ionic contamination and how to prevent it at DFM
Copper wrap protects the board edge from moisture ingress and handling damage. Learn when wrap plating is required: how to specify depth and thickness
Underfill is chosen for reliability and then blocks every repair. A practical guide to heat and mechanical removal: board-local rework limits, when to scrap
Jetting a board is not the same as qualifying the process. A practical qualification protocol for stencil-free solder paste deposition
Parylene thickness cannot be specified as one number. A practical guide to specifying thickness by location: mask scheme selection
How stencil aperture geometry controls solder paste release: area ratio and transfer efficiency maths, the step-stencil rules for fine pitch and connectors
Gerber files are your product. A practical guide to NDA scope: tooling ownership, controlled data transfer, counterfeit and clone risk, auditability clauses
How a contract manufacturer's OQC gate should be built: inspection basis, AQL sampling, the data pack a buyer should receive
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