Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
How pin-in-paste reflow removes a soldering step: the paste volume maths, stencil aperture design, connector temperature limits and the defects to control.
Choosing a flux chemistry for PCBA: residue type: surface insulation resistance under humidity, the real cost of cleaning
Cavity and step-cavity PCB design: grounding and the cost drivers behind recessed and embedded features
Stencil-free SMT line engineering, paste handling SOP, takt math and the staffing shift versus a stencil printer
What carbon and ESG data a PCB supplier can actually provide: kWh per m2, product carbon footprint boundaries, Scope 2 and 3 reality
How to verify an AS9100D PCB supplier: certificate scope wording, OASIS lookup, AS5553 counterfeit controls, AS9102 FAI and the AS9100 versus ITAR distinction
Board-level EMI shielding for PCBA: when to use a metal can vs a fence-and-lid: shielding effectiveness targets, gasket selection
When to specify buried and blind vias in an HDI stackup: sequential lamination cost, aspect ratio limits
Aluminum and metal-core (IMS) PCB design rules: dielectric options, thermal path calculations, single-sided limits, LED and power applications
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