
Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
What a PCB and PCBA test report package must contain: microsection, impedance, solderability, cleanliness, SPI/AOI/X-ray data, CoC and PPAP documents.
How PCB and PCBA payments are structured by milestone, what qualifies a buyer for net terms and how tooling ownership and deposits work on first orders.
How to specify PCB marking: ink vs laser vs silkscreen, UID and UDI traceability, reflow-rated labels and IPC legibility criteria for buyers.
What actually consumes SMT changeover time, and what to ask a supplier so you can compare their setup performance on high-mix and small-batch programs
A procurement playbook for component shortages: BOM risk matrix by lifecycle state, a six-rung mitigation ladder, UL/IATF certification impact
How to remove conformal coating from a PCB without ruining it — solvents, thermal, laser and parylene removal plus IPC-7711 rework and re-coat rules.
How to specify PCB finishes and processes that suppress tin whiskers, conformal coating barriers and the spec language to put in your PO
IST, HATS and IPC-TM-650 thermal shock compared, resistance-change criteria and how to choose the right via reliability test for your product class
Masking method by coating chemistry decision guide covering polyester tape, peelable liquid mask, silicone boots and dispense-only routing, with cost