Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
NRE and tooling charges on a PCB assembly order broken into the four cost buckets behind the line item, amortisation math, and when waiving NRE is legitimate.
How export control: ITAR and ECCN classification affect PCB and PCBA sourcing from China, the documentation to request
OEM, ODM and EMS models compared by who owns the design and IP, who carries the risk and how to choose the right model for a new electronics programme.
How to use SPI data to control solder paste volume, paste height specs and the process window that keeps a line in control
How to interpret SMT first pass yield correctly: yield definitions that differ between suppliers, benchmark ranges by product class
When nitrogen reflow is worth the cost: O2 ppm targets by component type, the solderability and wetting physics behind it
When stencil-free SMT beats stencils for NPI and prototype builds: tooling cost, changeover time, break-even volume, paste jetting and dispense options
How to evaluate a solder paste jetting machine, and a break-even cost model against stencil printing. For low-volume and high-mix SMT runs
How to calculate SMT line capacity correctly. OEE and bottleneck identification. A planning framework for buyers and manufacturing engineers
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