Huaxing PCBA PCB manufacturing insights and articles

Insights & Resources

Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.

PCB ESD Packaging & Shipping Standards — IPC-1601 & Moisture Barrier for Cross-Border Transp

PCB ESD Packaging & Shipping Standards — IPC-1601 & Moisture Barrier for Cross-Border Transp

Complete guide to PCB ESD packaging and shipping standards: IPC-1601 requirements, moisture barrier bags, vacuum sealing, desiccant specifications, and humidity

ESD Control in PCB Assembly — ANSI/ESD S20.20 Program Requirements & Supplier Audit Checklist

ESD Control in PCB Assembly — ANSI/ESD S20.20 Program Requirements & Supplier Audit Checklist

ESD control program requirements for PCB assembly per ANSI/ESD S20.20 — HBM/CDM damage models, EPA grounding, ionizers, packaging per ESD S541, and a 10-point s

PCB EMI/EMC Design Guide — Emissions Control, Immunity & Compliance Testing for FCC/CE Mark

PCB EMI/EMC Design Guide — Emissions Control, Immunity & Compliance Testing for FCC/CE Mark

Complete PCB EMI/EMC design guide: stackup strategies, ground plane design, shielding, filtering, and pre-compliance testing. Pass FCC Part 15 and CE EN 55032 o

PCB Design for EMC/EMI Compliance — How to Specify Electromagnetic Compatibility Requirements for Yo

PCB Design for EMC/EMI Compliance — How to Specify Electromagnetic Compatibility Requirements for Yo

EMC compliance failures cost PCB buyers $15,000-$50,000 per redesign cycle. This guide covers the 5 PCB design decisions that determine whether your board passe

Embedded Passive Components in PCB — Buried Capacitance & Resistor Technology for Miniaturized E

Embedded Passive Components in PCB — Buried Capacitance & Resistor Technology for Miniaturized E

When should you replace discrete SMD passives with embedded components inside PCB layers? Compare planar capacitance, buried resistors, and trade-offs in cost,

PCB Edge Plating & Castellations Guide — Sidewall Metallization for IoT Modules, Bluetooth &

PCB Edge Plating & Castellations Guide — Sidewall Metallization for IoT Modules, Bluetooth &

Complete PCB edge plating and castellated holes design guide: when to use sidewall metallization vs half-holes, minimum web specs, copper-to-edge clearance, pla

Dual Sourcing PCB Assembly — Risk Management & Multi-Supplier Qualification Strategy

Dual Sourcing PCB Assembly — Risk Management & Multi-Supplier Qualification Strategy

How to qualify and manage multiple PCB assembly suppliers without quality drift. Supplier scorecard framework, dual-sourcing cost model, transition planning, an

PCB Design for Testability (DFT) — Test Point Placement, Boundary Scan & ICT Access Strategies

PCB Design for Testability (DFT) — Test Point Placement, Boundary Scan & ICT Access Strategies

Complete DFT guide for PCB designers: test point placement rules, boundary scan (JTAG 1149.1) implementation, ICT fixture design considerations, flying probe ac

PCB Depaneling Methods Comparison — Routing, V-Scoring, Laser & Punching: Which Method Fits Your Boa

PCB Depaneling Methods Comparison — Routing, V-Scoring, Laser & Punching: Which Method Fits Your Boa

Comprehensive comparison of PCB depaneling methods: router, V-score, laser, and punching. Edge quality, stress analysis, cost per panel, and design rules for ea

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