Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
PCB silkscreen legend design rules: minimum line width and character height per IPC-2221, reference designator placement, polarity and pin-1 marks
PCB fiducial mark design rules: fiducial size and shape, solder mask clearance, global vs local fiducials, minimum placement from board edge
PCB depanelization methods compared: V-score vs tab routing vs laser cutting. Depth rules, edge quality, flexible board handling, cost and yield
Choose the right thermal interface material (TIM) for a power PCB: gap pad vs thermal paste vs phase-change vs liquid metal: thermal conductivity, thickness
Combine a low-loss RF laminate (Rogers) with economical FR-4 in a single stackup: Dk and Df fields, CTE matching, prepreg selection, layer ordering
Design the LAN magnetics module right: isolation transformer turns ratio, common-mode choke, 1500V isolation, creepage, Bob Smith termination
Solder-mask-defined (SMD) vs non-solder-mask-defined (NSMD) PCB pads, and which pad type to use for QFN, BGA, 0201 and power pads. A practical decision guide
QFN and LGA leadless package soldering: exposed thermal pad voiding, stencil aperture design to IPC-7525, reflow and wetting
CE marking for imported electronic products and how the Declaration of Conformity and technical file are put together for a finished unit
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