
Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Heavy copper PCB manufacturing from 3oz to 6oz: design rules for trace spacing, thermal management strategies, plating requirements
High-Density Interconnect PCB technology explained, and when the cost of HDI is justified by board space savings. Real data from 32-layer production
Step-by-step Gerber file preparation guide for PCB buyers. Learn which layers your manufacturer needs, and the RS-274X vs Gerber X2 format decision
Complete flex PCB design and manufacturing guide covering polyimide vs polyester substrates, IPC-2223 bend radius rules, coverlay vs solder mask
ENIG, HASL, OSP, Immersion Silver: Immersion Tin, ENEPIG — which surface finish is right for your application? Compare cost, shelf life, solderability
Learn the 8 most impactful PCB DFM rules from our engineering team. Proper annular ring sizing: thermal relief design
Technical PCB requirements for consumer electronics, and lightweight rigid-flex designs for drones. Real production data from an IATF 16949
Complete BGA assembly guide covering reflow profiling for 0.3mm pitch BGAs, X-ray void analysis standards and the 5 defect categories that matter most
Complete guide to automotive PCB requirements: IATF 16949 certification, AEC-Q100 reliability testing