Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Complete guide to PCB burn-in testing and environmental stress screening: HASS vs HALT, burn-in duration by industry, MTBF prediction
Via stubs create signal reflections that destroy high-speed signal integrity above 5 Gbps. Learn how back drilling removes stubs
Low-volume PCB assembly for 50-500 units without MOQ penalties. Covers NRE cost reduction: panel sharing, negotiation tactics
IPC-A-610: J-STD-001, and IPC-6012 serve different purposes in PCB procurement. Learn which standard to reference on your PO, how they overlap
How to manage component obsolescence in PCB assembly: EOL forecasting, last-time buy calculations, BOM health scoring, and redesign strategies for industrial
Complete comparison of COB (Chip-on-Board): COG (Chip-on-Glass), and SMT assembly technologies. Learn when to use each, wire bonding, encapsulation
Compare ceramic (Al₂O₃, AlN): PTFE (Teflon), and polyimide PCB substrates, Dk/Df, thermal conductivity, Tg, cost, and application fit for RF, aerospace
How PCB design and manufacturing choices affect audio performance: substrate materials for low dielectric loss, ground plane design for noise isolation
Complete PCB signal integrity design guide covering crosstalk prevention, termination strategies, differential pair routing, return path design
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