Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Complete guide to VR and AR headset PCB design: any-layer HDI for 4K micro-displays, rigid-flex boards for the temple area, thermal management for 5W+ modules
SMT vs through-hole PCB assembly compared: mixed-technology boards and how to choose the right process for your product
Switch-mode power supply PCB layout rules: critical loop minimization, inductor placement, sense-line routing, ground planes
Engineering guide to RFID and NFC antenna PCB design: 13.56MHz coil antenna tuning, UHF 860-960MHz impedance matching, antenna-on-PCB manufacturing tolerances
Complete guide to PCB warpage control: root cause analysis, IPC-TM-650 measurement methodology, design and material strategies
PCB vibration and shock testing guide covering JESD22-B103/B104 and MIL-STD-810 test methods, fixture design, acceleration levels
PCB thermal cycling testing guide covering IPC-9701 and JESD22-A104 methods, temperature ranges, dwell times and Weibull solder fatigue analysis
A step-by-step guide to migrating PCB production to a new supplier: pre-transition audit, phased ramp-up, FAI requirements, overlap management
PPAP for PCB assembly explained. PPAP vs FAI vs ISIR, and the supplier red flags procurement engineers must catch
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