PCB manufacturing types overview

Capabilities / PCB Types

Every PCB Type.
One Manufacturing Partner.

From standard FR-4 multi-layer to advanced any-layer HDI, flexible polyimide circuits, Rogers RF laminates, aluminum MCPCBs, high-speed digital, and heavy copper power boards, we manufacture 24 PCB types across 7 categories under one roof.

24PCB Types
3/3milFinest Trace
40LMax Layers
IPC 3Class Standard
Advanced PCB Capabilities
FR-4 Standard & High-Tg
HDI Any-Layer
Flex & Rigid-Flex
Rogers / PTFE RF
High-Speed Digital
Aluminum MCPCB
Heavy Copper 12oz
HDI PCB microvia detail HDI

HDI PCB, High Density Interconnect

Layers: 4–24
Via: 75µm laser
Trace: 3/3mil
BGA: 0.3mm pitch
1+N+12+N+2Any-LayerVIPCopper-Fill
Full HDI specs
IC Substrate carrier PCB HDI

IC Substrate & Carrier PCB

Layers: 2–8
Via: 50µm UV
Trace: 2/2mil
Thickness: 0.1–0.3mm
BT ResinABFFine-LineFlip-Chip
IC substrate specs
Semi-Flex bend-to-install PCB HDI

Semi-Flex PCB

Layers: 2–8
Bend: 1-time install
Material: FR-4 thinned
Cost: vs rigid-flex
Cost-SavingBend-to-InstallFR-4 Based
Request quote
Flexible PCB polyimide coverlay Flex

Flexible PCB, Polyimide Circuits

Layers: 1–8
Bend: ≥1mm radius
Coverlay: 12.5–50µm
Stiffener: FR-4/PI/SS
AdhesivelessSculpturedDynamic FlexLCP Option
Flex specs
Rigid-Flex hybrid PCB Flex

Rigid-Flex PCB, Hybrid Construction

Config: Up to 10R+4F
Rigid: FR-4 / High-Tg
Flex: Polyimide
Bonding: No-flow PP
2R+2F to 10R+4FBookbinderAir-GapZIF Tail
Rigid-flex details
FPC with EMI shielding Flex

FPC, Flexible Printed Circuit

Layers: 1–6
Pitch: ≥0.15mm
Finish: ENIG / ENEPIG
Shield: Silver ink / film
Connector ReplacementEMI ShieldZIF Contact
Submit FPC design
RF PCB precision impedance traces RF

RF / Microwave PCB, Rogers & PTFE

Materials: Rogers/Taconic/Arlon
Dk range: 2.2–10.2
Impedance: ±5% TDR verified
Frequency: Up to 77GHz
4350B/4003CRT/duroid 5880Hybrid StackupENIG/Imm Ag
RF capability details
Hybrid RF-digital PCB RF

Hybrid RF-Digital PCB

Stackup: Rogers + FR-4 hybrid
Layers: 4–16
Isolation: >60dB channel
Cost: vs all-RF laminate
Mixed-SignalCost-OptimizedAntenna + Digital
Hybrid RF stackup
mmWave antenna array PCB RF

mmWave Antenna PCB

Frequency: 24–77GHz
Material: RO3003 / LCP
Finish: Immersion Silver
Array: Up to 256 elements
5G AAU77GHz RadarBeamformingPatch Array
Telecom applications
Aluminum MCPCB LED power Thermal

Aluminum MCPCB, Metal-Core

Layers: 1–4
Thermal: 1–3 W/m·K
Base: Al 0.8–3.0mm
Dielectric: 75–150µm
LED LightingPower SupplyAutomotive HIDCOB
MCPCB specs
Copper-core extreme thermal PCB Thermal

Copper-Core PCB

Layers: 1–2
Thermal: Up to 380 W/m·K
Base: Cu 1.0–2.0mm
Application: Extreme heat
High-Power LEDLaser DiodeIGBT Module
Copper-core inquiry
Ceramic substrate Al2O3 AlN Thermal

Ceramic PCB, Al₂O₃ & AlN

Material: 96% Al₂O₃ / AlN
Thermal: 20–170 W/m·K
Metallization: DPC / DBC / AMB
Thickness: 0.25–1.0mm
UV LEDPower ModuleHermeticHigh-Temp
Ceramic PCB specs
Heavy copper 12oz power electronics PCB Power

Heavy Copper PCB, Up to 12oz

Outer Cu: Up to 12oz (420µm)
Inner Cu: Up to 6oz (210µm)
Layers: 2–12
Mask: Double-coat above 4oz
BMSEV ChargerWelding InverterVRM
Heavy copper specs
Embedded copper bus bar PCB Power

Bus Bar PCB, Embedded Copper

Copper: Up to 40oz custom
Layers: 2–6
Current: 200A+ rated
Process: Laminated bus bar
Power DistributionUPSMotor Drive
Custom bus bar inquiry
Mixed-weight copper PCB Power

Mixed-Weight Copper PCB

Power layers: 4–6oz
Signal layers: 1–2oz
Layers: 4–16
Control: Impedance ±5%
Server VRMMotor ControllerPower + Logic
Mixed-weight stackup
High-speed digital PCB Megtron 6 HSD

High-Speed Digital PCB

Material: Megtron 6/7/8
Data Rate: Up to 112Gbps PAM4
Layers: 8–40+
Skew: ±1ps intra-pair
400G/800GPCIe 5.0/6.0BackplaneSerDes
High-speed specs
Low-loss high-frequency PCB Tachyon-100G HSD

Low-Loss RF/Microwave PCB

Material: Tachyon-100G / I-Tera MT40
Df @10GHz: ≤0.002
Copper: Ultra-smooth HVLP
Application: 5G / Data Center
112G5G NRmmWaveSatcom
Telecom applications
Embedded passives PCB HSD

Embedded Passives PCB

Technology: Planar capacitance / buried R
Cap density: Up to 5nF/cm²
Layers: 6–24
Benefit: Reduced BOM count
PDN OptimizationMiniaturizationZBCOhmega-Ply
Embedded passives
Back-drill PCB signal integrity Specialty

Back-Drill PCB, Signal Integrity

Stub: ≤10mil controlled
Depth: ±2mil tolerance
Layers: 8–40+
Rate: Up to 56Gbps PAM4
BackplaneServer112GLow-Loss
Back-drill specs
Edge-plated castellated PCB Specialty

Edge-Plated & Castellated PCB

Plating: Full edge / selective
Castellation: Half-hole ±0.05mm
Finish: ENIG / HASL
Application: Module carrier
IoT ModuleBluetooth/WiFiShield Can
Ultra-thin wearable PCB Specialty

Ultra-Thin PCB

Thickness: 0.1–0.4mm
Layers: 2–8
Material: FR-4 / Polyimide
Stiffener: Optional PI/FR-4
WearableSmart CardMedical PatchSensor
Consumer applications
Gold finger edge connector PCB Specialty

Gold Finger PCB

Au thickness: 30–50µ" hard gold
Bevel: 20°/30°/45°
Ni barrier: 100–150µ"
Application: PCIe / DIMM / mezzanine
PCIe CardMemory ModuleBackplaneDaughter Card
Gold finger specs
Cavity PCB embedded component Specialty

Cavity PCB, Embedded Component

Cavity depth: ±2mil tolerance
Type: Open / stepped / buried
Layers: 4–20
Application: Chip embedding / RF
Die CavityRF ShieldComponent Embed
Cavity PCB inquiry
Standard multilayer FR-4 PCB Specialty

Standard Multilayer PCB, FR-4

Layers: 2–40
Material: FR-4 / High-Tg / Halogen-Free
Trace: 4/4mil standard
Finish: ENIG / HASL / OSP / Imm Ag
General PurposeConsumerIndustrialAutomotive
Standard PCB specs

High-Speed Digital, 112Gbps Ready

Signal Integrity.
Beyond 100 Gigabits.

High-speed digital PCBs demand ultra-low-loss laminates, precision impedance control, and back-drilling to remove via stubs. Our Megtron 6/Tachyon-100G stackups support 112Gbps PAM4 signaling with intra-pair skew under ±1ps, ready for 800G data center, 5G infrastructure, and AI accelerator designs.

  • Materials: Megtron 6/7/8, Tachyon-100G, I-Tera MT40, RO4835
  • Copper: Ultra-smooth HVLP (Rz ≤ 1.5µm) for reduced skin-effect loss
  • Back-drill: Stub removal ≤10mil, depth tolerance ±2mil
  • Testing: TDR impedance verification, VNA S-parameter to 50GHz
High-speed digital PCB differential pair routing

Don't See Your PCB Type? We Engineer Custom Solutions.

Specialty laminates, unusual stackups, tight tolerances, our engineering team reviews every project individually. Send your specs and we'll respond with a detailed manufacturing assessment within 24 hours.