PCB manufacturing types overview

Capabilities / PCB Types

Every PCB Type.
One Manufacturing Partner.

From standard FR-4 multi-layer to advanced any-layer HDI, flexible polyimide circuits, Rogers RF laminates, aluminum MCPCBs, high-speed digital, and heavy copper power boards — we manufacture 24 PCB types across 7 categories under one roof.

24PCB Types
3/3milFinest Trace
40LMax Layers
IPC 3Class Standard
Advanced PCB Capabilities
FR-4 Standard & High-Tg
HDI Any-Layer
Flex & Rigid-Flex
Rogers / PTFE RF
High-Speed Digital
Aluminum MCPCB
Heavy Copper 12oz
HDI PCB microvia detail HDI

HDI PCB — High Density Interconnect

Layers: 4–24
Via: 75µm laser
Trace: 3/3mil
BGA: 0.3mm pitch
1+N+12+N+2Any-LayerVIPCopper-Fill
Full HDI specs
IC Substrate carrier PCB HDI

IC Substrate & Carrier PCB

Layers: 2–8
Via: 50µm UV
Trace: 2/2mil
Thickness: 0.1–0.3mm
BT ResinABFFine-LineFlip-Chip
IC substrate specs
Semi-Flex bend-to-install PCB HDI

Semi-Flex PCB

Layers: 2–8
Bend: 1-time install
Material: FR-4 thinned
Cost: vs rigid-flex
Cost-SavingBend-to-InstallFR-4 Based
Request quote
Flexible PCB polyimide coverlay Flex

Flexible PCB — Polyimide Circuits

Layers: 1–8
Bend: ≥1mm radius
Coverlay: 12.5–50µm
Stiffener: FR-4/PI/SS
AdhesivelessSculpturedDynamic FlexLCP Option
Flex specs
Rigid-Flex hybrid PCB Flex

Rigid-Flex PCB — Hybrid Construction

Config: Up to 10R+4F
Rigid: FR-4 / High-Tg
Flex: Polyimide
Bonding: No-flow PP
2R+2F to 10R+4FBookbinderAir-GapZIF Tail
Rigid-flex details
FPC with EMI shielding Flex

FPC — Flexible Printed Circuit

Layers: 1–6
Pitch: ≥0.15mm
Finish: ENIG / ENEPIG
Shield: Silver ink / film
Connector ReplacementEMI ShieldZIF Contact
Submit FPC design
RF PCB precision impedance traces RF

RF / Microwave PCB — Rogers & PTFE

Materials: Rogers/Taconic/Arlon
Dk range: 2.2–10.2
Impedance: ±5% TDR verified
Frequency: Up to 77GHz
4350B/4003CRT/duroid 5880Hybrid StackupENIG/Imm Ag
RF capability details
Hybrid RF-digital PCB RF

Hybrid RF-Digital PCB

Stackup: Rogers + FR-4 hybrid
Layers: 4–16
Isolation: >60dB channel
Cost: vs all-RF laminate
Mixed-SignalCost-OptimizedAntenna + Digital
Hybrid RF stackup
mmWave antenna array PCB RF

mmWave Antenna PCB

Frequency: 24–77GHz
Material: RO3003 / LCP
Finish: Immersion Silver
Array: Up to 256 elements
5G AAU77GHz RadarBeamformingPatch Array
Telecom applications
Aluminum MCPCB LED power Thermal

Aluminum MCPCB — Metal-Core

Layers: 1–4
Thermal: 1–3 W/m·K
Base: Al 0.8–3.0mm
Dielectric: 75–150µm
LED LightingPower SupplyAutomotive HIDCOB
MCPCB specs
Copper-core extreme thermal PCB Thermal

Copper-Core PCB

Layers: 1–2
Thermal: Up to 380 W/m·K
Base: Cu 1.0–2.0mm
Application: Extreme heat
High-Power LEDLaser DiodeIGBT Module
Copper-core inquiry
Ceramic substrate Al2O3 AlN Thermal

Ceramic PCB — Al₂O₃ & AlN

Material: 96% Al₂O₃ / AlN
Thermal: 20–170 W/m·K
Metallization: DPC / DBC / AMB
Thickness: 0.25–1.0mm
UV LEDPower ModuleHermeticHigh-Temp
Ceramic PCB specs
Heavy copper 12oz power electronics PCB Power

Heavy Copper PCB — Up to 12oz

Outer Cu: Up to 12oz (420µm)
Inner Cu: Up to 6oz (210µm)
Layers: 2–12
Mask: Double-coat above 4oz
BMSEV ChargerWelding InverterVRM
Heavy copper specs
Embedded copper bus bar PCB Power

Bus Bar PCB — Embedded Copper

Copper: Up to 40oz custom
Layers: 2–6
Current: 200A+ rated
Process: Laminated bus bar
Power DistributionUPSMotor Drive
Custom bus bar inquiry
Mixed-weight copper PCB Power

Mixed-Weight Copper PCB

Power layers: 4–6oz
Signal layers: 1–2oz
Layers: 4–16
Control: Impedance ±5%
Server VRMMotor ControllerPower + Logic
Mixed-weight stackup
High-speed digital PCB Megtron 6 HSD

High-Speed Digital PCB

Material: Megtron 6/7/8
Data Rate: Up to 112Gbps PAM4
Layers: 8–40+
Skew: ±1ps intra-pair
400G/800GPCIe 5.0/6.0BackplaneSerDes
High-speed specs
Low-loss high-frequency PCB Tachyon-100G HSD

Low-Loss RF/Microwave PCB

Material: Tachyon-100G / I-Tera MT40
Df @10GHz: ≤0.002
Copper: Ultra-smooth HVLP
Application: 5G / Data Center
112G5G NRmmWaveSatcom
Telecom applications
Embedded passives PCB HSD

Embedded Passives PCB

Technology: Planar capacitance / buried R
Cap density: Up to 5nF/cm²
Layers: 6–24
Benefit: Reduced BOM count
PDN OptimizationMiniaturizationZBCOhmega-Ply
Embedded passives
Back-drill PCB signal integrity Specialty

Back-Drill PCB — Signal Integrity

Stub: ≤10mil controlled
Depth: ±2mil tolerance
Layers: 8–40+
Rate: Up to 56Gbps PAM4
BackplaneServer112GLow-Loss
Back-drill specs
Edge-plated castellated PCB Specialty

Edge-Plated & Castellated PCB

Plating: Full edge / selective
Castellation: Half-hole ±0.05mm
Finish: ENIG / HASL
Application: Module carrier
IoT ModuleBluetooth/WiFiShield Can
Edge-plating inquiry
Ultra-thin wearable PCB Specialty

Ultra-Thin PCB

Thickness: 0.1–0.4mm
Layers: 2–8
Material: FR-4 / Polyimide
Stiffener: Optional PI/FR-4
WearableSmart CardMedical PatchSensor
Consumer applications
Gold finger edge connector PCB Specialty

Gold Finger PCB

Au thickness: 30–50µ" hard gold
Bevel: 20°/30°/45°
Ni barrier: 100–150µ"
Application: PCIe / DIMM / mezzanine
PCIe CardMemory ModuleBackplaneDaughter Card
Gold finger specs
Cavity PCB embedded component Specialty

Cavity PCB — Embedded Component

Cavity depth: ±2mil tolerance
Type: Open / stepped / buried
Layers: 4–20
Application: Chip embedding / RF
Die CavityRF ShieldComponent Embed
Cavity PCB inquiry
Standard multilayer FR-4 PCB Specialty

Standard Multilayer PCB — FR-4

Layers: 2–40
Material: FR-4 / High-Tg / Halogen-Free
Trace: 4/4mil standard
Finish: ENIG / HASL / OSP / Imm Ag
General PurposeConsumerIndustrialAutomotive
Standard PCB specs

High-Speed Digital — 112Gbps Ready

Signal Integrity.
Beyond 100 Gigabits.

High-speed digital PCBs demand ultra-low-loss laminates, precision impedance control, and back-drilling to remove via stubs. Our Megtron 6/Tachyon-100G stackups support 112Gbps PAM4 signaling with intra-pair skew under ±1ps — ready for 800G data center, 5G infrastructure, and AI accelerator designs.

  • Materials: Megtron 6/7/8, Tachyon-100G, I-Tera MT40, RO4835
  • Copper: Ultra-smooth HVLP (Rz ≤ 1.5µm) for reduced skin-effect loss
  • Back-drill: Stub removal ≤10mil, depth tolerance ±2mil
  • Testing: TDR impedance verification, VNA S-parameter to 50GHz
High-speed digital PCB differential pair routing

Don't See Your PCB Type? We Engineer Custom Solutions.

Specialty laminates, unusual stackups, tight tolerances — our engineering team reviews every project individually. Send your specs and we'll respond with a detailed manufacturing assessment within 24 hours.