Advanced PCB manufacturing

Capabilities / Advanced PCB

Beyond Standard,
High-End PCB Manufacturing

HDI any-layer, flexible circuits, rigid-flex hybrids, Rogers/PTFE high-frequency laminates, heavy copper up to 12oz, ceramic substrates, and advanced processes like back-drilling and via-in-pad. Every board manufactured in-house to IPC Class 3 standards with full traceability.

3/3 milMin Trace/Space
75µmLaser Microvia
16:1Aspect Ratio
IPC 3Class Standard
Browse PCB Types
Any-Layer HDI
Flex & Rigid-Flex
Rogers / PTFE RF
Heavy Copper 12oz
Ceramic / AlN
Back-Drill / VIP

HDI Technology

Any-Layer Microvia.
Maximum Routing Density.

HDI PCBs use laser-drilled microvias (as small as 75µm) to connect layers with far greater density than traditional through-hole vias. Our any-layer HDI process, also known as "every-layer interconnect" or ELIC, allows any layer to connect to any other layer directly, maximizing routing freedom in compact designs.

  • Types supported: 1+N+1, 2+N+2, 3+N+3, any-layer (ELIC)
  • Laser via diameter: 75µm (CO₂) / 50µm (UV) depending on material
  • Copper-filled & planarized: VIP (via-in-pad) for 0.3mm BGA pitch
  • Stacked & staggered: copper-filled stacking for reliability in thermal cycling
  • Max layers: 24-layer HDI with 6-order any-layer interconnection
HDI stackup with microvias

Flexible & Rigid-Flex

Circuits That Bend.
Assemblies That Fit.

Flexible PCBs replace bulky wiring harnesses and connectors. Rigid-flex combines rigid board sections with flexible interconnects in a single, foldable assembly, eliminating connectors, reducing weight, and improving reliability in space-constrained applications.

  • Flex types: Single-sided, double-sided, multilayer flex, sculptured flex
  • Rigid-flex configs: 2R+2F through 10R+4F+10R and beyond
  • Substrates: Polyimide (adhesive & adhesiveless), LCP for mmWave
  • Stiffeners: FR-4, polyimide, stainless steel, aluminum
  • Bend radius: As low as 1mm with dynamic flex-rated copper (RA/ED)
  • Coverlay: 12.5/25/50µm polyimide with selective openings
Rigid-flex PCB

High-Frequency / RF

Signal Integrity at
Millimeter-Wave Frequencies

When every dB of loss matters, the laminate defines performance. We stock Rogers, Taconic, Arlon, and Isola low-loss materials, and we precision-machine RF structures with ±5% impedance control verified by TDR on every controlled-impedance panel.

  • Materials in stock: Rogers 4350B/4003C/3003/5880, Taconic TLY/RF/TLC, Isola Astra MT77
  • Hybrid laminates: Rogers + FR-4, PTFE + FR-4 for cost-optimized mixed-signal
  • Impedance: ±5% (standard), ±3% (on request), TDR verified per panel
  • Surface finish: ENIG, Immersion Silver (smooth RF surface), ENEPIG
  • Typical applications: 5G AAU, 77GHz radar, satellite transceivers, RF test fixtures
High-frequency RF PCB

Advanced Capabilities, Difficulty Matrix

TechnologyStandardMediumAdvancedOn Request
Layer Count1–14
Layer Count (Advanced), 16–24
HDI Type1+N+1
Any-Layer HDI, 4–12L
Flex PCB1–2L
Rigid-Flex PCB, 4–10L
FR-4 (Standard Tg), ,
High-Tg FR-4 / Halogen-Free,
Rogers 4000 Series, ,
PTFE (Taconic/Arlon), ,
Ceramic (Al₂O₃/AlN), ,
Aluminum MCPCB, ,
Copper Weight 0.5–3oz,
Copper Weight 4–8oz, ,
Copper Weight 10–12oz, ,
Trace/Space 5/5mil+,
Trace/Space 3/3mil, ,
Aspect Ratio ≤8:1,
Aspect Ratio 10–16:1, ,
Back-Drill, ,
Via-in-Pad (VIP), ,
Edge Plating, ,
Gold Fingers 30–50µ",
ENIG / ENEPIG,
Impedance ±10%,
Impedance ±5%, ,

Heavy Copper

High Current.
Low Temperature Rise.

Heavy copper PCBs carry tens to hundreds of amperes while keeping temperature rise within safe limits. Our extended plating process builds copper thickness evenly across the board, inner and outer layers, with controlled profile uniformity verified by cross-section microscopy on every lot.

  • Outer layers: Up to 12oz (420µm) finished copper
  • Inner layers: Up to 6oz (210µm) with lamination optimized for thick copper
  • Mixed weights: Combine 4oz power planes with 1oz signal layers in one stackup
  • Solder mask: Double-coat required above 4oz to ensure complete coverage
  • Typical applications: BMS, EV onboard charger, welding inverter, server VRM, power distribution
Heavy copper PCB

Have an Advanced PCB Requirement? We'll Engineer the Solution.

Send your stackup, layer count, material preferences, and any special process requirements. Our senior engineers will review feasibility and return a detailed manufacturing plan within 24 hours.