Capabilities / Advanced PCB
HDI any-layer, flexible circuits, rigid-flex hybrids, Rogers/PTFE high-frequency laminates, heavy copper up to 12oz, ceramic substrates, and advanced processes like back-drilling and via-in-pad. Every board manufactured in-house to IPC Class 3 standards with full traceability.
HDI Technology
HDI PCBs use laser-drilled microvias (as small as 75µm) to connect layers with far greater density than traditional through-hole vias. Our any-layer HDI process — also known as "every-layer interconnect" or ELIC — allows any layer to connect to any other layer directly, maximizing routing freedom in compact designs.
Flexible & Rigid-Flex
Flexible PCBs replace bulky wiring harnesses and connectors. Rigid-flex combines rigid board sections with flexible interconnects in a single, foldable assembly — eliminating connectors, reducing weight, and improving reliability in space-constrained applications.
High-Frequency / RF
When every dB of loss matters, the laminate defines performance. We stock Rogers, Taconic, Arlon, and Isola low-loss materials, and we precision-machine RF structures with ±5% impedance control verified by TDR on every controlled-impedance panel.
| Technology | Standard | Medium | Advanced | On Request |
|---|---|---|---|---|
| Layer Count | 1–14 | |||
| Layer Count (Advanced) | — | 16–24 | ||
| HDI Type | 1+N+1 | |||
| Any-Layer HDI | — | 4–12L | ||
| Flex PCB | 1–2L | |||
| Rigid-Flex PCB | — | 4–10L | ||
| FR-4 (Standard Tg) | — | — | ||
| High-Tg FR-4 / Halogen-Free | — | |||
| Rogers 4000 Series | — | — | ||
| PTFE (Taconic/Arlon) | — | — | ||
| Ceramic (Al₂O₃/AlN) | — | — | ||
| Aluminum MCPCB | — | — | ||
| Copper Weight 0.5–3oz | — | |||
| Copper Weight 4–8oz | — | — | ||
| Copper Weight 10–12oz | — | — | ||
| Trace/Space 5/5mil+ | — | |||
| Trace/Space 3/3mil | — | — | ||
| Aspect Ratio ≤8:1 | — | |||
| Aspect Ratio 10–16:1 | — | — | ||
| Back-Drill | — | — | ||
| Via-in-Pad (VIP) | — | — | ||
| Edge Plating | — | — | ||
| Gold Fingers 30–50µ" | — | |||
| ENIG / ENEPIG | — | |||
| Impedance ±10% | — | |||
| Impedance ±5% | — | — |
Heavy Copper
Heavy copper PCBs carry tens to hundreds of amperes while keeping temperature rise within safe limits. Our extended plating process builds copper thickness evenly across the board — inner and outer layers — with controlled profile uniformity verified by cross-section microscopy on every lot.
Send your stackup, layer count, material preferences, and any special process requirements. Our senior engineers will review feasibility and return a detailed manufacturing plan within 24 hours.
Upload your Gerber files and requirements. Free review within 24 hours.