
Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
GNSS receiver PCB design rules for GPS, GLONASS, Galileo and BeiDou modules — antenna feed line, LNA placement, ground plane, impedance control, shielding and a
Step-by-step Gerber file preparation guide for PCB buyers. Learn which layers your manufacturer needs, how to avoid the 5 most common errors that delay producti
GaN USB-C fast charger PCB design guide — 65W to 240W power stage layout, loop inductance and gate drive rules, thermal management, EMI control, USB PD 3.1 rout
FPGA PCB design rules for Xilinx and Intel FPGAs — power sequencing, decoupling capacitor networks, layer stackup, high-speed I/O routing, BGA assembly and firs
Flip-chip PCB substrate requirements: 40μm bump pitch, low-CTE core materials, capillary underfill process windows, and thermal via arrays for 100W+ die. A sour
Complete flex PCB design and manufacturing guide: polyimide vs polyester substrates, IPC-2223 bend radius rules, coverlay vs solder mask, dynamic vs static flex
Fitness equipment PCB design guide: treadmill and elliptical control boards, high-current motor drive with safety relays, console display boards and the EMC/cer
Fine-pitch SMT assembly guide for 01005 and 0201 components — placement accuracy, laser-cut stencil design, Type 4/5 solder paste, reflow profiling, and AOI res
PCB manufacturing requirements for fire alarm control panels, smoke detectors, and life safety systems. UL 864 compliance, high-temperature reliability, and red