Huaxing PCBA PCB manufacturing insights and articles

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Insights & Resources

Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.

PCB Stiffener Guide — FR-4, Polyimide & Steel for Flex Circuits

PCB stiffener guide covering FR-4, polyimide and stainless steel stiffeners for flex and rigid-flex boards, material selection, thickness rules

Implantable Medical Device PCB — Miniaturization, Biocompatibility & Reliability

Implantable medical PCB guide covering miniaturized multilayer boards, hermetic packaging, biocompatible materials

GPU PCB Design — High-Layer Stackups, VRM Layout & Thermal Management

GPU PCB design guide. PCIe 5.0 signal integrity and thermal management for graphics cards and AI accelerators

UPS PCB Design — Inverter, Charger & Bypass Layout for Uninterruptible Power

UPS PCB design guide covering static bypass and heavy-copper thermal management for reliable uninterruptible power

LiDAR PCB Design — SPAD Arrays, High-Speed Data & Thermal Management

LiDAR PCB design guide covering high-speed point-cloud data paths and thermal management for automotive and robotics sensors

Access Control PCB Design — Multi-Door Controllers, PoE & Battery Backup

Access control system PCB design: multi-door controller layout, Wiegand and OSDP reader interfaces, electric lock outputs

PCB Hole Accuracy & Drilling Tolerance — Position, Size & IPC-6012 Limits

Drilled hole size: position accuracy and annular ring requirements explained, IPC-6012 tolerance classes

Filled Via & Via-in-Pad — IPC-4761 Via Fill Types & Reliability Guide

Copper-filled, resin-filled and conductive-paste vias explained: IPC-4761 types, via-in-pad rules, cost impact and DFM guidance for BGA and HDI boards.

IoT Positioning Module PCB Design — GNSS, UWB & BLE AoA Integration

Multi-radio positioning module PCB design: GNSS + UWB + BLE AoA coexistence, antenna separation, power integrity and RTLS hardware integration guide.