Capabilities / PCBA Assembly

Full-Spectrum PCB Assembly —
SMT, THT & Box-Build

8 high-speed SMT lines running 24/6. 01005 passives through BGA/QFN. IPC-A-610 Class 2/3. IATF 16949 & ISO 13485 certified. Free assembly DFM review — we validate your BOM, placement, and paste stencil before the first component is placed.

8SMT Lines

200KCPH Per Line

01005Smallest Component

0.25mmBGA Pitch

Core Specifications

Every Process. Every Package.

01005–BGA

Component Range

From 01005 (0.4×0.2mm) chip components to large BGAs (>55mm), QFNs, CSPs, LGAs, and PoP (Package-on-Package). Fine-pitch down to 0.25mm BGA and 0.3mm QFP. Connectors, relays, transformers, and shielded modules.

200K CPH/Line

Placement Speed

High-speed modular SMT lines with dual-lane capability. Up to 200,000 components per hour per line. Automatic changeover reduces downtime between batches. Suitable for both high-mix low-volume and mass production runs.

1,200×510

Max Board Size (mm)

Standard PCB size up to 510×460mm. Extended rail up to 1,200×510mm for LED strips and backplanes. Board thickness 0.3mm–6.0mm. Panel up to 600×800mm with fixture support for over-sized assemblies.

Soldering Technologies

SMT reflow — 10-zone oven, N₂ atmosphere, ±1.5°C profile control. Wave soldering — dual-wave for mixed-technology boards. Selective soldering — nozzle-based for through-hole on double-sided SMT. Lead-free (SAC305) or leaded (Sn63Pb37).

IPC Class 3

Workmanship Standard

IPC-A-610 Class 2 as standard for commercial/industrial products. Class 3 for aerospace, medical, and automotive. IPC J-STD-001 for soldering process. ANSI/ESD S20.20 ESD control.

Free

DFM & BOM Validation

Every order includes a free assembly DFM review. We validate footprint-to-package match, paste stencil aperture, polarity/orientation, component spacing, and BOM part number cross-reference before production start.

Assembly Process Flow

Solder Paste Printing

Laser-cut stencil (0.08–0.2mm). Automatic paste inspection (SPI). 100% area coverage check per pad.

Pick & Place

High-speed & fine-pitch placement. Vision alignment. Real-time component verification. Feeder and reel traceability.

Reflow Soldering

10-zone profile. N₂ atmosphere. ±1.5°C per zone. Ramp-soak-spike to J-STD-020. Post-reflow cooling control.

AOI Inspection

3D AOI on every board after reflow. Solder joint quality, bridging, tombstoning, lifted leads. Automatic pass/fail.

Test & Conformal Coating

ICT, FCT, flying probe. X-Ray for BGA/QFN. Conformal coating. Final QA before packaging.

Complete Assembly Specifications

Parameter	Standard	Advanced
SMT Lines	8 high-speed lines	Dedicated NPI line for prototypes
Placement Speed	Up to 200,000 CPH / line	Dual-lane, concurrent placement
Smallest Component	0201 (0.6×0.3mm)	01005 (0.4×0.2mm)
Largest Component	55×55mm BGA	On request
Fine-Pitch BGA	0.25mm pitch minimum
Fine-Pitch QFP/QFN	0.3mm pitch minimum
Board Size	50×50mm–510×460mm	Up to 1,200×510mm (extended rail)
Board Thickness	0.8mm–3.2mm	0.3mm–6.0mm
Solder Type	SAC305 (Pb-free), Sn63Pb37 (leaded)
Stencil Thickness	0.1–0.15mm laser-cut SS	0.08–0.2mm, stepped stencils
Reflow Zones	10-zone, N₂ atmosphere
Wave Soldering	Dual-wave, lead-free
Selective Soldering	Nozzle-based, programmed per board
Conformal Coating	Acrylic, silicone, polyurethane. Selective spray + manual touch-up
Potting / Encapsulation	Epoxy, silicone, polyurethane. Vacuum degas available.
Workmanship	IPC-A-610 Class 2	IPC-A-610 Class 3 / J-STD-001 Space
ESD Control	ANSI/ESD S20.20, full ESD flooring & grounding

Inspection & Testing

SPI

Solder Paste Inspection on every print. 3D volumetric measurement. 100% pad coverage. Catch stencil issues before placement — no rework downstream.

3D AOI

Automatic Optical Inspection on every board after reflow. 3D solder joint profiling. Bridging, tombstoning, lifted leads, missing components. Automatic pass/fail with human review on borderline cases.

X-Ray

2D/3D X-Ray for BGA, QFN, and hidden joints. Void detection, solder ball integrity, bridging under packages. Mandatory for Class 3 assemblies. Programmable inspection paths per board design.

ICT

In-Circuit Test — bed-of-nails fixture per design. Component value verification, open/short detection, polarity check. Fixture design and fabrication in-house. Flying probe available for low-volume / prototype.

FCT

Functional Circuit Test — powered-on board exercising real operating conditions. Custom test jig per product. Firmware flashing, calibration, and burn-in available. Full test report with every shipment.

Micro-Section

Cross-section analysis for process validation and failure analysis. Microscope to 500×. Solder joint IMC layer verification. Included with NPI runs. On-demand for production QA sampling.

Box-Build Integration

From PCB to Packaged Product

Assembly doesn't stop at the board. Our box-build service integrates PCBA into enclosures, cable harnesses, and finished products — tested, labeled, and retail-ready. We manage the full assembly chain, so you receive a product that's ready to ship to your customer or warehouse.

Enclosure assembly — mechanical integration into your custom or off-the-shelf enclosure
Wire harness & cable assembly — crimped, soldered, and labeled to your wiring schedule
Firmware flashing & provisioning — programmed per device with unique IDs / MACs / keys
Functional test & burn-in — powered-on testing per your test plan, burn-in cycles optional
Labeling, serialization & packaging — barcode/QR, retail packaging, drop-ship ready

Conformal Coating & Protection

Acrylic (AR)

General-purpose. Good moisture & fungus resistance. Easy rework. Widely used in consumer, industrial, and IoT products.

Silicone (SR)

Wide temperature range (-65 to +200°C). Excellent for automotive under-hood and aerospace high-temp environments.

Polyurethane (UR)

Excellent chemical & abrasion resistance. Fuel and solvent resistant. Common in industrial and harsh environments.

Parylene (XY)

Vapor-deposited nano-coating. Ultrathin (0.1–25µm), pinhole-free. The gold standard for medical implants and mil/aero electronics.

SMT Line Configuration

Station	Equipment	Capability
Solder Paste Printer	DEK Horizon 03iX / EKRA X5	±12.5µm alignment @ 2 Cpk. 2D + 3D SPI integration. Automatic stencil cleaning.
High-Speed Placer	Yamaha YSM40R / ASM SIPLACE TX2	Chip shooter: 01005–1005 at 200K CPH. 8× vision alignment. Dual-lane parallel placement.
Fine-Pitch Placer	Yamaha YSM20WR / ASM SIPLACE SX2	IC placer: BGA, QFP, QFN, CSP. 0.25mm BGA pitch. POP capable. ±15µm placement accuracy.
Reflow Oven	Heller 1913 Mk5 / ERSA Hotflow 3/20	10 zones, N₂ atmosphere. ±1.5°C ΔT. Dual-lane capable. Vacuum soldering option for void reduction.
AOI	Koh Young Zenith 2 / Mirtec MV-6	3D AOI with AI classification. 100% coverage in 4 angles. 25µm resolution. Real-time SPC.
X-Ray	Nikon XT V 160 / Nordson Dage Quadra 5	2D/3D X-Ray. Automatic void analysis. BGA/QFN/LGA inspection. 0.5µm feature detection.
Conformal Coating	Nordson Asymtek Select Coat SC-350	Selective spray + needle dispense. Programmable per-board. UV-cure option.

Full-Spectrum PCB Assembly —SMT, THT & Box-Build