Trust Through Testing
IPC-A-610 Class 2 and Class 3. 100% inspection. Seven-stage QC process. ISO 9001 & UL certified for automotive-grade reliability.
Certifications
Safety certification for PCB materials and finished boards. UL file available.
Restriction of hazardous substances. REACH compliant processes — certificate on file.
EMC directive compliance per EN 55022 / EN 61000 series. Scan available on request.
China Quality Certification. Factory audited and product certified.
IPC-A-610 Class 2 & 3 acceptance. IPC-9252 electrical test. IPC-1601 handling.
Quality Control Process
Incoming material inspection: laminates, solder mask, chemicals, components — verified against spec before production
3D solder paste inspection on every SMT line before reflow — paste volume, height, area and offset measured in real time
100% automated optical inspection: opens, shorts, trace width violations, solder mask defects — both sides scanned
2D and CT X-Ray for BGA, QFN and hidden joints. Void analysis per IPC-7095. Standard on every BGA/QFN assembly
100% electrical test — flying probe for prototype/NPI, bed-of-nails ICT at volume. IPC-9252 Class 2 compliance
In-circuit and functional test with golden-sample verification: power-up, communication protocols, sensor calibration
Final visual + outgoing quality check. Vacuum-sealed packaging per IPC-1601. Documentation pack assembled
Testing Capabilities
2D and 3D AOI systems from Koh Young and Omron. Detects solder bridges, tombstoning, missing components, lifted leads, and polarity errors at production speed. 100% coverage — both sides, every board.
2D and CT X-Ray for BGA, QFN, and hidden-joint inspection. Void analysis per IPC-7095. Detects head-in-pillow, insufficient solder, and pad cratering. Standard on all BGA and QFN assemblies.
Flying probe for prototype and NPI (no fixture cost). Bed-of-nails ICT for volume production. Tests: opens, shorts, component values, diode/transistor orientation, capacitance, inductance. IPC-9252 compliant.
TDR (Time Domain Reflectometry) impedance testing with ±5% tolerance guarantee. Test coupons on every controlled-impedance panel. Polar Instruments CITS880s system. Report included with shipment.
Custom functional test fixtures built to your specification. Simulates real operating conditions: power-up, signal integrity, communication protocols, sensor calibration. Golden-sample verification before every run.
Destructive analysis on sacrificial coupons per production batch. Measures: copper plating thickness, intermetallic layer formation, hole wall quality, dielectric thickness, solder mask registration. Per IPC-6012.
Koh Young 3D SPI on every SMT line — before reflow. Measures paste volume, height, area, and offset. Catches insufficient paste, bridging, and misalignment before it becomes a defect. Real-time SPC feedback loop.
Solderability testing per IPC-J-STD-003 on test coupons. Thermal stress testing (288°C / 10s float) for delamination resistance. Tin whisker mitigation verification for lead-free finishes.
Automated UV inspection of conformal coating coverage and thickness per IPC-CC-830. Black-light booth for manual verification on complex geometries. Coating thickness measured at 5-point grid per board.
| Requirement | IPC Class 2 (Industrial) | IPC Class 3 (High Reliability) |
|---|---|---|
| Annular Ring (External) | 90° breakout allowed | Min. 0.05mm annular ring, no breakout |
| Annular Ring (Internal) | 90° breakout allowed, not connected | Min. 0.025mm annular ring |
| Solder Joint (PTH) | 180° circumferential wetting | 270° minimum, 330° preferred |
| Plating Void | < 5% of barrel length | < 2.5% of barrel length |
| Etchback / Negative Etchback | Allowed if no resin smear | Not permitted — positive etchback required |
| Solder Mask Clearance | ±0.075mm registration | ±0.05mm registration |
| Dielectric Spacing | > 0.09mm (external) | > 0.13mm (external) |
| Typical Applications | Industrial, consumer, commercial | Automotive, medical, aerospace, defense |
| Inspection Level | Sampling + 100% AOI/E-test | 100% visual + AOI + E-test + microsection |
| Cost Premium vs Class 2 | — | ~20–30% |
Continuous Improvement
Every critical process parameter — plating thickness, etch factor, line width, registration accuracy, solder paste volume — is monitored in real time via Statistical Process Control (SPC). Control charts track Cp and Cpk indices, triggering automatic alerts when any parameter drifts beyond ±1.5σ.
Each production batch includes a complete QC documentation package: AOI images, electrical test reports (IPC-9252), impedance test data (TDR plots), microsection images with measurements, Certificate of Conformance, RoHS/REACH compliance, and lot traceability records — archived for 3 years.
If any board fails outgoing QC inspection, we perform a root cause analysis and either rework or remanufacture — at our cost. For IPC Class 3 orders, any non-conformance triggers a full batch review, a corrective action report (CAR), and preventive action implementation within 48 hours. Your design files, production parameters, and test fixtures are retained for consistent quality across re-orders.
Request our quality manual, certificates, or a sample QC documentation package. See how we ensure zero-defect delivery.
Upload Gerber + BOM — 24h quote with free DFM review.
