Precision PCB Manufacturing
Up to 58 Layers
HUAXING manufactures PCBs in a wide range of materials and processes — from standard FR-4 to high-frequency Rogers, aluminum IMS, and rigid-flex. With up to 58 layers, 3/3 mil line/space, and full HDI capability, we produce boards for the most demanding applications.
PCB Manufacturing Capabilities
From HDI micro-via technology to heavy-copper backplanes and rigid-flex constructions — our manufacturing lines handle the full spectrum of PCB fabrication requirements.
HDI Technology
High-Density Interconnect with micro-via stacking, via-in-pad, and sequential lamination for compact, high-performance designs.
Blind & Buried Vias
Laser-drilled blind vias and mechanically drilled buried vias for space-saving layer interconnections in multilayer designs.
Impedance Control
Controlled impedance (±5%) with TDR verification for RF, high-speed digital, and differential pair requirements up to 100Ω.
Gold Fingers
Beveled gold fingers with hard gold plating (30–50µ") for edge-connector cards and PCIe/memory module applications.
Surface Finishes
Full range including ENIG (immersion gold), HASL leaded/lead-free, OSP, immersion silver, immersion tin, and hard/soft gold.
Backplane & Heavy Copper
Up to 6oz copper for high-current backplanes, power distribution boards, and thermal management applications.
Via-in-Pad & Plugging
Conductive and non-conductive via fill, tenting, and plugging with flat surface finish for BGA and dense component placement.
Edge Plating & Castellated Holes
Edge-plated PCBs with castellated solder points for module-on-base-board integration and custom form-factor designs.
Consumer Electronics Manufacturing
From set-top boxes to smart home devices, HUAXING delivers high-volume PCB manufacturing for consumer electronics at competitive prices without compromising quality.
Material Options
We work with the widest range of PCB laminates — choose the right material for your application requirements, from cost-effective FR-4 to high-performance Rogers and flex.
FR-4 Standard
Standard glass-epoxy laminate for general-purpose PCBs. Excellent mechanical strength, electrical insulation, and cost-efficiency.
Consumer electronics, industrial controls, lighting
High-Tg FR-4
High glass-transition-temperature (170°C+) material for lead-free soldering, multilayer boards, and high-reliability applications.
Automotive, telecom, servers, power electronics
Rogers (High-Frequency)
Ceramic-filled PTFE composites with stable dielectric constant and low loss tangent for RF and microwave circuits.
5G, RF amplifiers, antennas, radar systems
PTFE / Teflon
Ultra-low-loss PTFE laminates for high-frequency and high-speed digital applications requiring minimal signal degradation.
Microwave, satellite, aerospace, high-speed digital
Aluminum / Metal-Core
Aluminum-backed IMS (Insulated Metal Substrate) for excellent thermal dissipation in high-power LED and power electronics.
Power LED, motor drives, power supplies, automotive lighting
Flex & Rigid-Flex
Flexible polyimide laminates and combination rigid-flex constructions for dynamic-bending and space-constrained interconnects.
Wearables, medical devices, cameras, foldable electronics
Manufacturing Excellence
Our 45,000 m² manufacturing facility in Shenzhen is equipped with industry-leading machinery and staffed by 600+ skilled engineers and technicians. Every board is produced under strict quality controls with full traceability.
Certifications & Quality Control
Every board is manufactured under ISO 9001:2015 certified processes and tested against IPC and UL standards. Our in-house QC lab performs comprehensive testing on every production batch.
ISO 9001:2015
Quality management system for consistent product quality and continuous improvement.
UL 94V-0
Flammability rating ensuring all materials self-extinguish within 10 seconds — the highest industry standard.
RoHS & REACH
Full compliance with RoHS and REACH directives for lead-free and restricted-substance-free manufacturing.
IPC-A-600 Class 2/3
Acceptability criteria for printed boards — meeting both Class 2 (dedicated service) and Class 3 (high-reliability/harsh environment).
IPC-6012 Class 2/3
Qualification and performance specification for rigid PCBs, including Class 3 for mission-critical applications.
CAF-Resistant Materials
Anti-CAF (Conductive Anodic Filament) materials and processes for high-reliability, high-humidity environments.
In-House Quality Tests
Technical Specifications
Comprehensive PCB fabrication capabilities across all major process categories.
| Parameter | Capability |
|---|---|
| Max Layers | 58 |
| PCB Thickness | 0.2mm – 6.0mm |
| Copper Weight (Inner/Outer) | 0.5oz – 6oz |
| Min Line Width / Space | 3 / 3 mil |
| Min Mechanical Drill | 0.2mm |
| Min Laser Drill (HDI) | 0.075mm (3 mil) |
| Max Board Size | 600 × 600mm |
| Aspect Ratio | 12:1 (standard), 16:1 (advanced) |
| Surface Finishes | ENIG, HASL (lead-free/leaded), OSP, Immersion Ag, Immersion Sn, Hard Gold, Soft Gold |
| Solder Mask | Green, blue, red, black, white, yellow, matte, photoimageable |
| Legend / Silkscreen | White, yellow, black (liquid photoimageable) |
| Impedance Tolerance | ±5% (on specified layers) |
| Registration Tolerance | ±0.075mm (layers), ±0.05mm (drill) |
| Gold Finger Bevel | 30° – 45° angle, hard gold 30–50µ" |
| Via Fill Options | Conductive epoxy, non-conductive epoxy, tenting, plugging |
Ready to Manufacture Your PCBs?
Upload your Gerber files for a quick-turn quote. Our engineering team reviews every order before production to ensure manufacturability and competitive pricing.
Zero MOQ · Free DFM Review · ISO9001 & UL Certified · 24/7 Customer Support