Precision PCB Assembly
9 SMT + 4 DIP Lines
HUAXING operates 9 fully automatic SMT assembly lines equipped with Siemens/ASM and Yamaha placement machines, plus 4 DIP lines with wave and selective soldering. From 01005 micro-components to complex BGA assemblies — all inspected by AOI, X-ray, and flying probe systems.
SMT Assembly Capabilities
Our 9 SMT lines combine high-speed placement with ultra-fine-pitch accuracy for boards of any complexity. All lines are backed by AOI and SPI for zero-defect manufacturing.
High-Speed Placement
Siemens / ASM SIPLACE and Yamaha YSM series placement machines achieving 80,000+ CPH with ±25μm precision.
Fine-Pitch & Micro-BGA
Capable of placing BGA, QFP, QFN, micro-BGA, and PoP (Package on Package) with 0201 and 01005 chip components.
Solder Paste Printing
Laser-cut and electroformed stencils with automated solder paste inspection (SPI) for consistent paste volume and alignment.
RoHS & Lead-Free Assembly
Full leaded and lead-free (RoHS compliant) assembly capability with precise reflow profiling for all solder paste types.
Flexible Production
Mix of high-volume (Siemens/ASM) and flexible (Yamaha) lines enables rapid changeover and quick-turn prototyping.
Reflow Soldering
10-zone reflow ovens with nitrogen atmosphere capability for optimized thermal profiles on complex assemblies.
DIP & Through-Hole Assembly
4 dedicated DIP assembly lines handle all through-hole and mixed-technology requirements with wave soldering, selective soldering, and press-fit capabilities.
Wave Soldering
Lead-free and leaded wave soldering with flux spray and preheating for optimal through-hole joint quality.
Selective Soldering
Programmable selective soldering for mixed-technology boards requiring precise solder application to specific through-hole components.
Hand Soldering
Skilled hand soldering for rework, prototypes, and components unsuitable for automated processes.
Press-Fit Assembly
Automated and manual press-fit insertion for connectors and compliant-pin components.
Component Types We Assemble
Inspection & Quality Control
Every board is inspected at multiple stages. Our quality system ensures defects are caught early and every shipment meets your specifications.
AOI (Automated Optical Inspection)
6 AOI systems inspect solder joints, component presence, polarity, and alignment at production speed across all SMT and DIP lines.
X-Ray Inspection
Digital X-ray for hidden solder joints under BGA, QFN, and other bottom-terminated components. Detects voids, bridges, and insufficient solder.
Flying Probe Testing
Fixtureless electrical testing for opens, shorts, and component values. Ideal for prototypes and medium-volume runs without custom test fixtures.
ICT & Functional Testing
Custom fixture-based in-circuit testing and functional test solutions for volume production with full traceability and test reports.
Assembly Process Flow
From solder paste printing to final inspection — every board follows a standardized, controlled process to ensure repeatable quality.
Solder Paste Printing
Laser-cut stencil applied to bare PCB with precise paste volume controlled by SPI inspection.
Pick & Place
Components placed by Siemens/ASM or Yamaha machines at up to 80,000 CPH with vision alignment.
Reflow Soldering
10-zone convection reflow with nitrogen atmosphere and real-time temperature profiling.
AOI Inspection
Automated optical inspection catches placement, polarity, and soldering defects immediately after reflow.
DIP / Through-Hole
Wave or selective soldering for through-hole components, followed by visual inspection.
Final Inspection
X-ray, flying probe, or ICT testing depending on board complexity and customer requirements.
Special & Value-Added Services
Beyond standard assembly, we offer a comprehensive suite of value-added services to reduce your supply chain complexity and accelerate time-to-market.
Conformal Coating
Acrylic, silicone, urethane, and parylene conformal coating for protection against moisture, dust, chemicals, and extreme temperatures. Selective coating available.
Potting & Encapsulation
Epoxy and polyurethane potting for high-voltage, vibration-prone, or harsh-environment assemblies. Full or selective encapsulation options.
Ultrasonic & DI Water Cleaning
Removes flux residues and contaminants using ultrasonic baths and deionized water rinse for high-reliability and medical-grade assemblies.
Box Build & Full Turnkey Assembly
End-to-end assembly from bare PCB and BOM procurement through SMT, DIP, testing, conformal coating, and final box build integration.
BOM Procurement & Management
Full turnkey procurement with component sourcing, obsolescence management, and kitting. Over 5,000 verified supplier relationships.
Engineering Support & DFM
Design for Manufacturing (DFM) review, panelization optimization, stencil design, and test strategy consultation before production begins.
Assembly Line Overview
Our 9 SMT lines combine high-speed Siemens/ASM placement with flexible Yamaha lines, enabling rapid changeover between prototypes and volume production. Each line is equipped with inline 3D SPI, AOI, and real-time process monitoring.
Ready to Start Your Assembly Project?
Upload your Gerber files and BOM for a quick-turn quote. Our engineering team reviews every project before production to ensure manufacturability and optimal pricing.
Zero MOQ · Free DFM Review · ISO9001 & UL Certified · 24/7 Customer Support