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Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Professional PCB reverse engineering and legacy board replication: clone discontinued or single-source PCBs for industrial equipment, medical devices, and milit
Compare Automated Optical Inspection (AOI), X-Ray, and Solder Paste Inspection (SPI) for PCB assembly quality control. Coverage rates, defect types caught, cost
Flip-chip PCB substrate requirements: 40μm bump pitch, low-CTE core materials, capillary underfill process windows, and thermal via arrays for 100W+ die. A sour
MSL classification determines whether your PCBs survive reflow or delaminate from trapped moisture. This guide covers MSL levels 1-6, floor life, baking require
Comprehensive guide to telecom and 5G PCB manufacturing: Rogers/PTFE material selection, ±5% impedance control at GHz frequencies, 32-layer PCB fabrication for
Engineering guide to RFID and NFC antenna PCB design: 13.56MHz coil antenna tuning, UHF 860-960MHz impedance matching, antenna-on-PCB manufacturing tolerances,
Complete guide to PCB design for 5G mmWave at 28 GHz and 39 GHz. Covers low-loss laminate selection, antenna integration, launch design, and fabrication toleran
How to detect counterfeit PCBs and electronic components: blacktopping visual inspection, X-ray internal comparison, decapsulation, XRF material verification, a
Complete procurement guide to UL certification for PCBs: UL 796 base material standards, UL 94 V-0 flammability ratings, ZPMV2 recognized component marking, how
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