Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
PoE PCB design rules for powered devices and power sourcing equipment — 802.3af/at/bt power classes, isolation and creepage, magnetics placement, thermal design
PCB manufacturing tolerances explained for design and procurement engineers — standard vs tight limits for trace width, drill, annular ring, registration, imped
ESD control program requirements for PCB assembly per ANSI/ESD S20.20 — HBM/CDM damage models, EPA grounding, ionizers, packaging per ESD S541, and a 10-point s
Fine-pitch SMT assembly guide for 01005 and 0201 components — placement accuracy, laser-cut stencil design, Type 4/5 solder paste, reflow profiling, and AOI res
IPC-A-610 acceptance criteria explained for PCBA buyers — Class 1/2/3 solder joint rules, component damage limits, cleanliness requirements, and a 15-point inco
Mixed-signal PCB design guide: analog-digital partitioning, ground plane strategies, isolation techniques, and layer stackup optimization — with production data
Complete PCB conformal coating guide: acrylic, silicone, urethane, epoxy & parylene materials compared. IPC-CC-830 standards, application methods, and inspe
Reduce PCB lead times from 4 weeks to 7 days. Covers design decisions that cut days, material selection impact, quick-turn vs standard economics, factory schedu
Hard gold vs soft gold vs ENIG vs ENEPIG: complete PCB gold plating comparison for edge connectors, wire bonding, and high-reliability contacts. Includes thickn
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