Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Camera module and image sensor PCB design guide — MIPI CSI-2 differential pair routing, sensor power supply noise control, clock and EMI management, FPC connect
High-speed connector PCB design guide — board-to-board, mezzanine and backplane connector selection, differential pair routing through connector pin fields, bre
BLE PCB design and manufacturing guide — 2.4 GHz trace antenna and chip antenna layout, 50 Ω matching networks, crystal and decoupling rules, Wi-Fi coexistence,
Portable power station PCB design and manufacturing — BMS cell balancing, high-current heavy-copper bus design, sine-wave inverter, MPPT input, GaN fast chargin
3D printer mainboard PCB design and manufacturing — stepper driver selection, heated-bed MOSFET sizing, thermistor accuracy, 12V vs 24V power architecture, and
Robot vacuum PCB design and manufacturing guide — LiDAR/ToF navigation, BLDC motor drive, BMS and charging contacts, mopping-model waterproofing, and the assemb
MCU PCB design guide — power decoupling placement, crystal oscillator layout and load capacitors, analog grounding for ADC accuracy, SWD debug port design, and
HDMI and DisplayPort PCB design guide — 100Ω differential pair routing, TMDS vs FRL vs UHBR requirements, ESD protection, and the stackup and fabrication notes
Cellular IoT module PCB design guide — LTE-M vs NB-IoT vs Cat-1 selection, antenna keep-out and 50Ω RF trace routing, transmit-burst power supply design, SIM in
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