Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Complete guide to vendor-managed inventory (VMI) and consignment stock programs for PCB procurement. Covers cost models, implementation steps, supplier qualific
PCB vibration and shock testing guide: JESD22-B103/B104 and MIL-STD-810 test methods, fixture design, acceleration levels, failure modes like cracked BGA balls,
Complete guide to PCB via types: through-hole vs blind vs buried vias, via-in-pad design rules, backdrilling for signal integrity, and microvia technology for H
Complete guide to PCB via fill types: non-conductive vs conductive epoxy, copper filled vias, plugged and tented vias. IPC-4761 classifications, thermal conduct
Underfill process guide for BGA, CSP and flip-chip: capillary vs no-flow vs molded underfill, material selection, void control and reliability testing.
Complete procurement guide to UL certification for PCBs: UL 796 base material standards, UL 94 V-0 flammability ratings, ZPMV2 recognized component marking, how
Complete guide to PCB trace width calculation for current carrying capacity. IPC-2152 vs IPC-2221 comparison, copper weight vs trace width charts, thermal rise
PCB total cost of ownership decoded: the 8 hidden cost drivers beyond unit price, a real TCO formula with 3 sourcing scenarios, and optimization strategies that
Comprehensive guide to PCB thermal management: thermal via design, copper pour strategies, substrate selection, and metal-core PCB solutions. From FR-4 to alumi
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